GE Intelligent Platforms’ rugged COM Express modules offer ultimate durability and varying levels of performance-per-watt. They are well-suited for OEMs designing computing platforms into equipment for industrial or harsh environments, and when reducing the overall design cycle and lowering validation costs are of key importance. Onboard components are specifically selected for their reliability in demanding conditions. Unlike solutions designed for benign environments, our processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes.
Based on AMD® R-series APU processing technology
Based on NVIDIA® Tegra® K1 GPU processing technology
COM Express for the most demanding applications
Embedded computing is on a journey to the edge of the network – see how GE is employing NVIDIA’s innovative GPU technology to enable brilliant machines.