COM Express

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GE Intelligent Platforms’ rugged COM Express modules offer ultimate durability and varying levels of performance-per-watt. They are well-suited for OEMs designing computing platforms into equipment for industrial or harsh environments, and when reducing the overall design cycle and lowering validation costs are of key importance. Onboard components are specifically selected for their reliability in demanding conditions. Unlike solutions designed for benign environments, our processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes.

Active Products

Product Name Form Factor Processor Chip Set Conformal Coating Cooling I/O Maximum Memory
bCOM6-L1200 Rugged COM Express Module COM Express Basic, Type 6 VIA Nano or VIA Eden DDI 8 GB DDR3 SDRAM
bCOM6-L1400 Rugged COM Express Module COM Express Basic, Type 6 3rd Gen. Intel Core i7 dual/quad-core up to 2.5 GHz DDI 8 GB DDR3 SDRAM with ECC
bCOM6-L1700 Rugged COM Express Module COM Express Basic, Type 6 2nd Gen. AMD R-Series APU Audio, DDI, Gigabit Ethernet, GPIO, SATA, USB, VGA Up to 16 GB DDR3 SDRAM with ECC
bCOM6-P1100 Rugged COM Express Module COM Express Basic, Type 6 Freescale QorIQ P1022 DDI 8 GB DDR3 SDRAM with ECC
mCOM10-K1 Mini COM Express COM Express mini, Type 10 NVIDIA Tegra K1 SoC NVIDIA Tegra K1 SoC Option Air Audio, Gigabit Ethernet, GPIO, HDMI or DV1, LVDS, SATA, USB 2 GB of DDR3L
mCOM10-L1500 Rugged COM Express Module COM Express mini, Type 10 AMD Embedded G-Series SOC Audio, GPIO 1 GB SDRAM with ECC

Discontinued Products

Product Name Short Description
bCOM2-L1100 bCOM2-L1100 Rugged COM Express Module for applications needing mid- to high-level performance and Type 2 pinouts.