Rugged COM Express Module

Intel ISA

Intel ISA


This product reached the end of its lifecycle (end-of-life) on September 15, 2014

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GE understands that long design cycles and high validation costs make it difficult for OEMs to keep up with the latest processor technologies. We also know that processors deployed in harsh environments need to deliver the utmost performance at all times, under any condition.

To address these needs, GE developed the bCOM2-L1100 Type 2 module. This module takes advantage of the Intel Core 2 Duo processor to deliver high-performance, low power consumption, embedded real-time computing. As such, the bCOM2-L1100 is well suited for OEMs designing embedded computing platforms into equipment for industrial or harsh environments. This durable COM Express solution reduces the overall design cycle and lowers validation costs.



Rugged design with soldered components

•    Reliable computing capabilities for applications needing higher immunity to shock and vibration

Intel Core 2 Duo processors in varying levels of performance-per-watts

•    Delivers mid- to high-level performance coupled with low power consumption

•    Configure the module for the level of performance-per-watt your application requires

Dynamic thermal management

•     Enables controlled system shutdown to avoid damage to equipment

•    Offers cost saving by allowing simulation in the lab before conducting field tests

Flexible options

•    Additional shock and vibration protection

•    Extended operating temperature range for environments with temperature extremes

•   Conformal coating for protection against dust, moisture and chemicals

•   Solutions available based on standard or custom carriers


Form Factor
COM Express Basic, Type 2
Intel Core 2 Duo @ 2.26 GHz
Maximum Memory
Up to 4 GB DDR3