Using VITA 75 and standards-based modular design to address SWaP-C challenges
By: David Pepper, Product Manager/Technologist, GE Intelligent Platform
Military Embedded Systems, December 2014 Issue
As the world's armed forces look to deploy computing capability and unmanned vehicles ever closer to the battlefield edge, size, weight, and power (SWaP) are at a premium. The use of modular building blocks such as COM Express (PICMG COM.0) and/or XMC (VITA 42) – and, for packaging, the rugged small form factor (VITA 75) – represent an excellent means to address the requirements of minimizing size, weight, power, and cost (SWaP-C).