SWaP sweeps and edge processors adapt

A GE Intelligent Platforms perspective on embedded military electronic trends

By: Charlotte Adams, Contributing Editor, Military Embedded Systems

Military Embedded Systems, October 2014 Issue

Size, weight, and power (SWaP) considerations have always been important for embedded electronics, but as platforms shrink, SWaP constraints are becoming ever more critical. Larger platforms will, of course, continue to use “big” processors that are optimized for performance. However, the proliferation of intelligence at the tactical edge is driving military demand for rugged off-the-shelf chips, modules, and boards that provide just enough performance for their applications. These parts must burn minimal power and produce minimum heat but at the same time offer maximum design flexibility, upgradability, and support.