Rugged Solution Expertise at Heart Of New High Performance COM Express Module From GE
• First GE COM Express module to feature high performance Freescale™ PowerP™ processor • bCOM6-P1100 delivers high level of immunity to shock/vibration, temperature extremes • Further strengthens GE’s ability to deliver high performance solutions for co
CHARLOTTESVILLE, VA November 13, 2012 GE Intelligent Platforms today announced the bCOM6-P1100 Rugged Type 6 COM Express Module, a board designed for deployment in challenging or harsh commercial environments such as mining, forestry, construction, oil & gas, food & beverage, networking, industrial automation control and power & energy. The company has incorporated its extensive experience in developing high performance rugged solutions for military applications into this new product.
The bCOM6-P1100, which expands GE’s COM Express portfolio by adding a Freescale™ PowerPC™ processor, also takes advantage of GE’s expertise in the optimization of thermal performance.
“Any manufacturing company producing fewer than 10,000 units per year should be seriously considering COM Express,” said Tommy Swigart, Product Manager, GE Intelligent Platforms. “The COM Express architecture is uniquely attractive for many applications because of its price/performance, extremely low power consumption, modularity, flexibility, longevity and investment protection, and the bCOM6-P1100 implementation brings those benefits to customers who also need a solution that can withstand deployment in hostile environments.”
“For organizations looking to take advantage of the benefits of COM Express technology in locations beyond the data center or office environment, the bCOM6-P1100 offers the optimum solution.”
GE specifically selected on-board components for theirreliability in demanding conditions, and, unlike solutions designed for benign environments, processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes.
The small form factor of the COM Express architecture is attractive to organizations looking to deploy embedded computing in constrained environments, while its separation of processor and carrier board allows simple, cost-effective upgrades that enable optimum operation to be maintained, minimize re-qualification costs, maximize asset performance and decrease lifetime cost of ownership.
For OEMs and systems integrators looking for solutions that deliver high performance coupled with low power consumption, the bCOM6-P1100 offers a range of two Freescale PowerPC QorIQ processor options, with performance between 800MHz and 1.2GHz (x2) and power consumption between 3.5W and 13.0W. Up to 8GB of DDR3 SDRAM with ECC can be configured, allowing the most demanding applications to be deployed.
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For more information: www.ge-ip.com/products/com-express/
For more technical information: http://www.ge-ip.com/account/download/13388/3650
A high res image can be found at: www.genewscenter.com/imagelibrary/detail.asp?MediaDetailsID=5267
For more information, contact:
Ian McMurray, GE Intelligent Platforms
+44 (0) 1327 322821
Freescale is a trademark of Freescale Semiconductor Inc. PowerPC is a trademark of IBM Corp. All other trademarks are the property of their respective owners.