The Cutting Edge of Thermal Management

thermal management

By: Brian Hoden, Principal Mechanical Engineer, Embedded Engineering at GE Intelligent Platform

Military Embedded Systems, September 2014 Issue

The biggest challenge for system integrators today is thermal management. With access to the latest-generation processors, GPUs, and switch fabrics, system integrators must find creative ways to remove the heat created by this vast computing power. These thermal challenges call for innovative thermal solutions to maximize the performance for computing-intensive applications.