News Room

In The News, Events and Press Releases all at your fingertips.

GE has an extensive range of HPEC solutions - such as the DSP281 multiprocessor - designed for the harsh, demanding environments that are typical of military deployments.
Press Releases

GE to Help US Air Force Define High Performance Embedded Computing Architectures of the Future

HUNTSVILLE, AL.— MARCH 24, 2015—GE’s Intelligent Platforms business (NYSE: GE) today announced that it had been awarded a contract that will see the company undertaking a six month research program to help the United States Air Force define open architectures for future generations of radar processors onboard USAF platforms. The program will be carried out at GE’s HPEC Center of Excellence in Billerica, MA. The study involves the benchmarking...

More

Rich Carpenter, Chief of Software Strategy
In The News

The Industrial Internet: Big Machines, Big Data, Big Impact

In this episode of the future of work podcast, Forbes' Jacob Morgan speaks with Rich Carpenter who is the Chief of Strategy for GE's Intelligent Platforms division. Carpenter shares fascinating insight around how connected machines (usually very large machines) and devices are going to impact our economy, our jobs, and our future. He shares several examples and provides some great advice for business leaders and employees alike. Carpenter also...

More

Astrobotic's moon lander features GE/NVIDIA GPU technology
Press Releases

GE to Demonstrate at GTC how Rugged GPU-Enabled Embedded Computing can Enable Moon Landing, Exploration

HUNTSVILLE, AL.— March 17, 2015— At NVIDIA’s annual GTC – GPU Technology Conference (San Jose, March 17-20) - GE’s Intelligent Platforms business will be delivering a compelling demonstration of how combining NVIDIA’s expertise in GPU technology and GE’s expertise in rugged embedded computing solutions will allow high performance computing in the most challenging, inhospitable environments – onboard a spacecraft, and on the surface of the moon...

More

The RAR-XMC ARINC 429 High Density XMC Interface from GE Intelligent Platforms
Press Releases

GE Broadens Range of Cost-Effective, High Performance Avionics Solutions with XMC for ARINC 429

HUNTSVILLE, AL.— MARCH 10, 2015— GE’s Intelligent Platforms business (NYSE: GE) today announced the RAR-XMC ARINC 429 High Density XMC Interface for deployment on many single board computers. Available in a range of configurations to match customer needs, the RAR-XMC extends still further the breadth and depth of GE’s cost-effective, high performance avionics offering with complete, integrated databus functionality for ARINC 429 and related...

More

In The News

GE Argues for Ethernet Backbone

Just when you think everything new in the industry is really just a series of upgrades, manufacturers surprise you with some serious innovations. But given the ever-escalating complexity of manufacturing systems, the exponential growth of connections among devices and workers that is the Internet of Things (IoT), and the persistent threat from cybersecurity and safety realms, innovation is exactly what is needed. GE is talking about an...

More

Rich Carpenter, GE at the ARC Forum 2015
In The News

Industrial Internet Journey Begins with Asset Management

Whether you call it the Internet of Things, Industry 4.0, or the Industrial Internet, it’s all about connecting machines, processes and people wherever they may be. As one of the principal protagonists of Industrial Internet, GE has been very vocal about how this initiative will transform industry. Speaking with Rich Carpenter, GE’s chief technology strategist, while attending the ARC Forum earlier this month, he stressed that the Industrial...

More

Press Releases

New COM Express Module from GE Brings New Levels of Performance to Applications Constrained by Power Consumption and Size

HUNTSVILLE, AL.— FEBRUARY 24, 2015— GE’s Intelligent Platforms business (NYSE: GE) today announced at Embedded World (Nuremberg, Germany – 24-26 February) the mCOM10K1 Type 10 Mini COM Express Module. Based on the NVIDIA® Tegra® K1 system-on-chip (SOC) - enabling it to deliver 326 GFLOPS of performance, well beyond the performance typically associated with Mini COM Express - it is ideal for applications where very high performance in data-...

More

GE Intelligent Platforms fully rugged bCOM6-L1700 Type 6 COM Express Module
Press Releases

New Module from GE Brings Benefits of COM Express Architecture to Harsh Environments

CHARLOTTESVILLE, VA.— FEBRUARY 24, 2015—GE’s Intelligent Platforms business (NYSE: GE) today announced at Embedded World (Nuremberg, Germany – 24-26 February) the fully rugged bCOM6-L1700 Type 6 COM Express Module. Differentiated from ‘commodity’ COM Express modules by its high performance, extreme durability and low lifetime cost of ownership, it features the latest R-Series System-on-Chip (SoC) from AMD, providing it with not only superior...

More

GE has won an order valued at ~$100m to equip the the British Army’s SCOUT Specialist Vehicle (SV) platforms
Press Releases

GE Intelligent Platforms Secures ~$100 Million Order from General Dynamics UK for British Army SCOUT SV Program

HUNTSVILLE, AL and TOWCESTER, ENGLAND.— FEBRUARY 3, 2015—GE’s Intelligent Platforms business (NYSE: GE) has announced that it has secured orders from General Dynamics UK valued at £64 million (~$100 million) to provide a range of embedded computing subsystems that will be deployed onboard the British Army’s SCOUT Specialist Vehicle (SV) platforms. The scalable, open architecture subsystems – which include Ethernet switches, gateway processors,...

More

In The News

Prequalified system-level COTS takes the load

With military budgets under fire and program schedules increasingly pinched, design managers are focusing more than ever on cost. Gone are the days of gold-plated programs entailing high risk of cost overruns and schedule breaches. Suppliers are on the hot seat to deliver systems within tight cost and time constraints. READ MORE...

More

GE Intelligent Platforms DAQMAG2A Rugged Display Computer
Press Releases

New Rugged High Performance Display Computer from GE Minimizes Cost, Risk and Time-to-Market

HUNTSVILLE, AL.— JANUARY 20, 2015—GE’s Intelligent Platforms business (NYSE: GE) today announced the high performance DAQMAG2A Rugged Display Computer. Designed to minimize cost, risk and time-to-market for prime contractors, systems integrators and OEMs developing sophisticated video capture, processing and transmission applications with multiple inputs and outputs, it is qualified to the DO-160G Environmental Conditions and Test Procedures for...

More

Press Releases

New Rugged High Performance Display Computer from GE Minimizes Cost, Risk and Time-to-Market

HUNTSVILLE, AL.— JANUARY 20, 2015—GE’s Intelligent Platforms business (NYSE: GE) today announced the high performance DAQMAG2A Rugged Display Computer. Designed to minimize cost, risk and time-to-market for prime contractors, systems integrators and OEMs developing sophisticated video capture, processing and transmission applications with multiple inputs and outputs, it is qualified to the DO-160G Environmental Conditions and Test Procedures for...

More

Frost & Sullivan Award
Press Releases

Frost & Sullivan Applauds GE’s Contribution toward Enabling the Vision of Smart Factories by Developing Real-Time Operational Intelligence for Plant Floor Processes

GE provides value-added workshops and training to help customers realize the potential of the company’s revolutionary automation software solutions MOUNTAIN VIEW, Calif. — December 17, 2014 — Based on its recent analysis of the human machine interface market, Frost & Sullivan recognizes GE’s Intelligent Platforms business with the 2014 Global Frost & Sullivan Company of the Year Award. GE’s foresight in using real-time operational...

More

MAGIC1
In The News

Using VITA 75 and standards-based modular design to address SWaP-C challenges

By: David Pepper, Product Manager/Technologist, GE Intelligent Platform Military Embedded Systems, December 2014 Issue As the world's armed forces look to deploy computing capability and unmanned vehicles ever closer to the battlefield edge, size, weight, and power (SWaP) are at a premium. The use of modular building blocks such as COM Express (PICMG COM.0) and/or XMC (VITA 42) – and, for packaging, the rugged small form factor (VITA 75) –...

More

Digital Image Processing
In The News

Digital Image Processing

By: Charlotte Adams, Contributing Editor, Military Embedded System Military Embedded Systems, November 2014 Issue High-definition (HD) digital electro-optic and infrared sensors are shoveling ever-more data into the battle space. How can soldiers get that information quickly enough to act on it in a timely manner? Intel data traditionally has been the preserve of the higher echelons, while trickle-down information has been the lot of the...

More